Medical device materials III: proceedings from the Materials & Processes for Medical Devices Conference
Ramakrishna Venugopalan, Ming Hsiung Wu
November 14-16, 2005, Boston, Massachusetts, USA
Kategori:
Tahun:
2006
Edisi:
1
Penerbit:
ASM International
Bahasa:
english
Halaman:
242
ISBN 10:
1628702109
ISBN 13:
9781628702101
Fail:
PDF, 16.67 MB
IPFS:
,
english, 2006